AM27LS01/BEX vs AM27LS01-1DC feature comparison

AM27LS01/BEX AMD

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AM27LS01-1DC AMD

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC ADVANCED MICRO DEVICES INC
Part Package Code DIP DIP
Package Description DIP, DIP, DIP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code 3A001.A.2.C EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 55 ns 45 ns
JESD-30 Code R-GDIP-T16 R-GDIP-T16
Length 19.431 mm 19.431 mm
Memory Density 256 bit 256 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Terminals 16 16
Number of Words 256 words 256 words
Number of Words Code 256 256
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -55 °C
Organization 256X1 256X1
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.5 V 5.25 V
Supply Voltage-Min (Vsup) 4.5 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade MILITARY COMMERCIAL EXTENDED
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
JESD-609 Code e0
Number of Ports 1
Output Characteristics OPEN-COLLECTOR
Output Enable NO
Package Equivalence Code DIP16,.3
Screening Level MIL-STD-883 Class C
Terminal Finish TIN LEAD

Compare AM27LS01/BEX with alternatives

Compare AM27LS01-1DC with alternatives