AM27C800-120DC vs KM23C8105B-12 feature comparison

AM27C800-120DC AMD

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KM23C8105B-12 Samsung Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC SAMSUNG SEMICONDUCTOR INC
Part Package Code DIP DIP
Package Description WDIP, DIP42,.6 DIP, DIP42,.6
Pin Count 42 42
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.61 8542.32.00.71
Access Time-Max 120 ns 120 ns
Alternate Memory Width 16 16
I/O Type COMMON
JESD-30 Code R-GDIP-T42 R-PDIP-T42
JESD-609 Code e0 e0
Length 54.864 mm 52.43 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type UVPROM MASK ROM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 42 42
Number of Words 1048576 words 1048576 words
Number of Words Code 1000000 1000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX8 1MX8
Output Characteristics 3-STATE 3-STATE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code WDIP DIP
Package Equivalence Code DIP42,.6 DIP42,.6
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE, WINDOW IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.08 mm
Supply Current-Max 0.05 mA 0.08 mA
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 15.24 mm 15.24 mm
Base Number Matches 2 1
Pbfree Code No
Standby Current-Max 0.00005 A

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