AM27C1024LEB
vs
AT27C1024-17KM/883
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
ADVANCED MICRO DEVICES INC
|
ATMEL CORP
|
Part Package Code |
LCC
|
LCC
|
Package Description |
QCCN, LCC44,.65SQ
|
WQCCJ,
|
Pin Count |
44
|
44
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
3A001.A.2.C
|
3A001.A.2.C
|
HTS Code |
8542.32.00.61
|
8542.32.00.61
|
Access Time-Max |
250 ns
|
170 ns
|
I/O Type |
COMMON
|
|
JESD-30 Code |
S-CQCC-N44
|
S-CQCC-J44
|
JESD-609 Code |
e0
|
|
Length |
16.51 mm
|
16.65 mm
|
Memory Density |
1048576 bit
|
1048576 bit
|
Memory IC Type |
UVPROM
|
UVPROM MODULE
|
Memory Width |
16
|
16
|
Number of Functions |
1
|
1
|
Number of Terminals |
44
|
44
|
Number of Words |
65536 words
|
65536 words
|
Number of Words Code |
64000
|
64000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Organization |
64KX16
|
64KX16
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
QCCN
|
WQCCJ
|
Package Equivalence Code |
LCC44,.65SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, WINDOW
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.54 mm
|
4.57 mm
|
Supply Current-Max |
0.06 mA
|
0.06 mA
|
Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
NO LEAD
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
16.51 mm
|
16.65 mm
|
Base Number Matches |
1
|
1
|
Moisture Sensitivity Level |
|
1
|
|
|
|
Compare AM27C1024LEB with alternatives
Compare AT27C1024-17KM/883 with alternatives