AM26LS31PC vs DS96F174MMW8 feature comparison

AM26LS31PC Texas Instruments

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DS96F174MMW8 National Semiconductor Corporation

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer TEXAS INSTRUMENTS INC NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP
Package Description PLASTIC, DIP-16 DIE, WAFER
Pin Count 16
Reach Compliance Code not_compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Texas Instruments
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00002 A 0.00002 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; FED STD 1020 EIA-422; EIA-485
JESD-30 Code R-PDIP-T16 X-XUUC-N
JESD-609 Code e0
Length 19.05 mm
Moisture Sensitivity Level 1
Number of Functions 4 4
Number of Terminals 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Out Swing-Min 2 V 1.5 V
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code DIP DIE
Package Equivalence Code DIP16,.3 WAFER
Package Shape RECTANGULAR UNSPECIFIED
Package Style IN-LINE UNCASED CHIP
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Seated Height-Max 4.318 mm
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO YES
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL UPPER
Transmit Delay-Max 15 ns 25 ns
Width 7.62 mm
Base Number Matches 1 1
Screening Level 38535Q/M;38534H;883B

Compare AM26LS31PC with alternatives

Compare DS96F174MMW8 with alternatives