AM26LS30PC vs AM26LS30MF feature comparison

AM26LS30PC AMD

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AM26LS30MF NXP Semiconductors

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC NXP SEMICONDUCTORS
Part Package Code DIP DIP
Package Description PLASTIC, DIP-16 DIP,
Pin Count 16 16
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature PROGRAMMABLE SLEW RATE
Differential Output YES YES
Driver Number of Bits 4 4
High Level Input Current-Max 0.00004 A
Input Characteristics STANDARD STANDARD
Interface IC Type LINE DRIVER LINE DRIVER
Interface Standard EIA-422; EIA-423 EIA-422; EIA-423
JESD-30 Code R-PDIP-T16 R-GDIP-T16
JESD-609 Code e0
Length 19.1135 mm 19.535 mm
Number of Functions 4 4
Number of Terminals 16 16
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Out Swing-Min 2 V
Output Characteristics 3-STATE 3-STATE
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Receive Delay-Max
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 30 mA 30 mA
Supply Voltage-Max 5.25 V 5.5 V
Supply Voltage-Min 4.75 V 4.5 V
Supply Voltage-Nom 5 V 5 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Transmit Delay-Max 200 ns 200 ns
Width 7.62 mm 7.62 mm
Base Number Matches 4 1

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