AM26LS30MF
vs
DS1691AJ
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Differential Output |
YES
|
YES
|
Driver Number of Bits |
2
|
2
|
High Level Input Current-Max |
0.00004 A
|
0.00004 A
|
Interface IC Type |
LINE DRIVER
|
LINE DRIVER
|
JESD-30 Code |
R-XDIP-T16
|
R-GDIP-T16
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-55 °C
|
-55 °C
|
Out Swing-Min |
2 V
|
2 V
|
Output Characteristics |
3-STATE
|
3-STATE
|
Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
TTL
|
BIPOLAR
|
Temperature Grade |
MILITARY
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Transmit Delay-Max |
300 ns
|
200 ns
|
Base Number Matches |
2
|
1
|
Samacsys Manufacturer |
|
Texas Instruments
|
Additional Feature |
|
CONFIGURABLE INTERFACE STANDARDS
|
Input Characteristics |
|
STANDARD
|
Interface Standard |
|
EIA-422; EIA-423
|
Length |
|
19.43 mm
|
Number of Functions |
|
2
|
Output Polarity |
|
COMPLEMENTARY
|
Seated Height-Max |
|
5.08 mm
|
Supply Current-Max |
|
30 mA
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Supply Voltage-Nom |
|
5 V
|
Width |
|
7.62 mm
|
|
|
|
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