AM2147-70DEB
vs
AM2147-70DM
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
ADVANCED MICRO DEVICES INC
Part Package Code
DIP
Package Description
DIP, DIP18,.3
DIP, DIP18,.3
Pin Count
18
Reach Compliance Code
unknown
unknown
ECCN Code
3A001.A.2.C
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
Additional Feature
AUTOMATIC POWER-DOWN
I/O Type
SEPARATE
SEPARATE
JESD-30 Code
R-GDIP-T18
R-XDIP-T18
JESD-609 Code
e0
e0
Length
22.86 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
1
1
Number of Functions
1
Number of Ports
1
Number of Terminals
18
18
Number of Words
4096 words
4096 words
Number of Words Code
4000
4000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-55 °C
-55 °C
Organization
4KX1
4KX1
Output Characteristics
3-STATE
3-STATE
Output Enable
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP18,.3
DIP18,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class C
MIL-STD-883 Class C
Seated Height-Max
5.08 mm
Standby Voltage-Min
4.5 V
4.5 V
Supply Current-Max
0.18 mA
0.18 mA
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
NMOS
MOS
Temperature Grade
MILITARY
MILITARY
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
Base Number Matches
1
2
Compare AM2147-70DEB with alternatives
Compare AM2147-70DM with alternatives