AM10474-15DCB
vs
MBM100474-15Z
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ADVANCED MICRO DEVICES INC
FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code
DIP
Package Description
DIP, DIP24,.4
DIP,
Pin Count
24
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
15 ns
15 ns
I/O Type
SEPARATE
JESD-30 Code
R-GDIP-T24
R-GDIP-T24
JESD-609 Code
e0
Length
30.5435 mm
30.3 mm
Memory Density
4096 bit
4096 bit
Memory IC Type
STANDARD SRAM
STANDARD SRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
24
24
Number of Words
1024 words
1024 words
Number of Words Code
1000
1000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
Organization
1KX4
1KX4
Output Characteristics
OPEN-EMITTER
OPEN-EMITTER
Output Enable
NO
NO
Package Body Material
CERAMIC, GLASS-SEALED
CERAMIC, GLASS-SEALED
Package Code
DIP
DIP
Package Equivalence Code
DIP24,.4
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.588 mm
5.84 mm
Supply Current-Max
0.2 mA
Surface Mount
NO
NO
Technology
ECL
ECL
Temperature Grade
COMMERCIAL EXTENDED
OTHER
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
10.16 mm
10.16 mm
Base Number Matches
1
2
Compare AM10474-15DCB with alternatives
Compare MBM100474-15Z with alternatives