AM10474-15DCB vs MBM100474-15Z feature comparison

AM10474-15DCB AMD

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MBM100474-15Z FUJITSU Semiconductor Limited

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DIP
Package Description DIP, DIP24,.4 DIP,
Pin Count 24
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 15 ns 15 ns
I/O Type SEPARATE
JESD-30 Code R-GDIP-T24 R-GDIP-T24
JESD-609 Code e0
Length 30.5435 mm 30.3 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 24 24
Number of Words 1024 words 1024 words
Number of Words Code 1000 1000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min
Organization 1KX4 1KX4
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.588 mm 5.84 mm
Supply Current-Max 0.2 mA
Surface Mount NO NO
Technology ECL ECL
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 10.16 mm 10.16 mm
Base Number Matches 1 1

Compare AM10474-15DCB with alternatives

Compare MBM100474-15Z with alternatives