AM100470ADC vs MBM10470A-10CZ feature comparison

AM100470ADC AMD

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MBM10470A-10CZ FUJITSU Semiconductor Limited

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Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC FUJITSU SEMICONDUCTOR AMERICA INC
Part Package Code DIP
Package Description DIP, DIP18,.3 DIP,
Pin Count 18
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 25 ns 10 ns
I/O Type SEPARATE
JESD-30 Code R-GDIP-T18 R-GDIP-T18
JESD-609 Code e0
Length 22.86 mm 22.78 mm
Memory Density 4096 bit 4096 bit
Memory IC Type STANDARD SRAM STANDARD SRAM
Memory Width 1 1
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 18 18
Number of Words 4096 words 4096 words
Number of Words Code 4000 4000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 75 °C
Operating Temperature-Min
Organization 4KX1 4KX1
Output Characteristics OPEN-EMITTER OPEN-EMITTER
Output Enable NO NO
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Current-Max 0.2 mA
Surface Mount NO NO
Technology ECL TTL
Temperature Grade OTHER COMMERCIAL EXTENDED
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 4 1

Compare AM100470ADC with alternatives

Compare MBM10470A-10CZ with alternatives