ADSP-1010ASG/883B
vs
TMC2210N0C3
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
ANALOG DEVICES INC
|
TRW LSI PRODUCTS INC
|
Part Package Code |
PGA
|
|
Package Description |
HERMETIC SEALED, PGA-68
|
DIP, DIP64,.9
|
Pin Count |
68
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Boundary Scan |
NO
|
|
External Data Bus Width |
16
|
|
JESD-30 Code |
S-CPGA-P68
|
R-PDIP-T64
|
JESD-609 Code |
e0
|
e0
|
Length |
27.81 mm
|
|
Low Power Mode |
NO
|
|
Number of Terminals |
68
|
64
|
Operating Temperature-Max |
125 °C
|
70 °C
|
Operating Temperature-Min |
-55 °C
|
|
Output Data Bus Width |
35
|
|
Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
Package Code |
PGA
|
DIP
|
Package Equivalence Code |
PGA68,11X11
|
DIP64,.9
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
GRID ARRAY
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Screening Level |
38535Q/M;38534H;883B
|
|
Seated Height-Max |
4.17 mm
|
|
Supply Current-Max |
100 mA
|
|
Supply Voltage-Max |
5.5 V
|
|
Supply Voltage-Min |
4.5 V
|
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
MILITARY
|
COMMERCIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
PIN/PEG
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
PERPENDICULAR
|
DUAL
|
Width |
27.81 mm
|
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
Base Number Matches |
1
|
2
|
|
|
|
Compare ADSP-1010ASG/883B with alternatives
Compare TMC2210N0C3 with alternatives