TMC2210N0C3
vs
LMA2010KM65
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
TRW LSI PRODUCTS INC
|
LOGIC DEVICES INC
|
Package Description |
DIP, DIP64,.9
|
QCCN, LCC68,.95SQ
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDIP-T64
|
S-CQCC-N68
|
JESD-609 Code |
e0
|
e0
|
Number of Terminals |
64
|
68
|
Operating Temperature-Max |
70 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
QCCN
|
Package Equivalence Code |
DIP64,.9
|
LCC68,.95SQ
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
IN-LINE
|
CHIP CARRIER
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
COMMERCIAL
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
THROUGH-HOLE
|
NO LEAD
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
QUAD
|
uPs/uCs/Peripheral ICs Type |
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
LCC
|
Pin Count |
|
68
|
ECCN Code |
|
3A001.A.2.C
|
Additional Feature |
|
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
|
Boundary Scan |
|
NO
|
External Data Bus Width |
|
16
|
Length |
|
24.13 mm
|
Low Power Mode |
|
NO
|
Moisture Sensitivity Level |
|
3
|
Output Data Bus Width |
|
35
|
Peak Reflow Temperature (Cel) |
|
225
|
Seated Height-Max |
|
3.048 mm
|
Supply Current-Max |
|
25 mA
|
Supply Voltage-Max |
|
5.5 V
|
Supply Voltage-Min |
|
4.5 V
|
Width |
|
24.13 mm
|
|
|
|
Compare TMC2210N0C3 with alternatives
Compare LMA2010KM65 with alternatives