TMC2210N0C3
vs
LMA1010GMB55
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
TRW LSI PRODUCTS INC
LOGIC DEVICES INC
Package Description
DIP, DIP64,.9
PGA, PGA68,11X11
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T64
S-CPGA-P68
JESD-609 Code
e0
e0
Number of Terminals
64
68
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, METAL-SEALED COFIRED
Package Code
DIP
PGA
Package Equivalence Code
DIP64,.9
PGA68,11X11
Package Shape
RECTANGULAR
SQUARE
Package Style
IN-LINE
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Nom
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
Tin/Lead (Sn/Pb)
TIN LEAD
Terminal Form
THROUGH-HOLE
PIN/PEG
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
PERPENDICULAR
uPs/uCs/Peripheral ICs Type
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
DSP PERIPHERAL, MULTIPLIER ACCUMULATOR/SUMMER
Base Number Matches
2
1
Part Package Code
PGA
Pin Count
68
ECCN Code
3A001.A.2.C
Additional Feature
2 X 16 BIT DATA INPUT BUS; ICC SPECIFIED @ 5MHZ
Boundary Scan
NO
Clock Frequency-Max
18.18 MHz
External Data Bus Width
16
Length
29.4386 mm
Low Power Mode
YES
Moisture Sensitivity Level
3
Output Data Bus Width
35
Peak Reflow Temperature (Cel)
225
Screening Level
38535Q/M;38534H;883B
Seated Height-Max
3.81 mm
Supply Current-Max
25 mA
Supply Voltage-Max
5.5 V
Supply Voltage-Min
4.5 V
Width
29.4386 mm
Compare TMC2210N0C3 with alternatives
Compare LMA1010GMB55 with alternatives