A54SX72ACQ256
vs
A54SX72A-CQ256B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
CERAMIC, QFP-256
QFF,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
72000 TYPICAL GATES AVAILABLE
IT CAN ALSO OPERATE WITH 3.3V AND 5V
Clock Frequency-Max
217 MHz
217 MHz
Combinatorial Delay of a CLB-Max
1.5 ns
1.4 ns
JESD-30 Code
S-CQFP-F256
S-CQFP-F256
JESD-609 Code
e0
Length
36 mm
36 mm
Number of CLBs
6036
4024
Number of Equivalent Gates
108000
108000
Number of Inputs
213
Number of Logic Cells
6036
Number of Outputs
213
Number of Terminals
256
256
Operating Temperature-Max
70 °C
125 °C
Operating Temperature-Min
-55 °C
Organization
6036 CLBS, 108000 GATES
4024 CLBS, 108000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFF
Package Equivalence Code
TPAK256,3SQ,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.3 mm
3.3 mm
Supply Voltage-Max
2.75 V
2.75 V
Supply Voltage-Min
2.25 V
2.25 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
MILITARY
Terminal Finish
TIN LEAD
Terminal Form
FLAT
FLAT
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Width
36 mm
36 mm
Base Number Matches
3
3
Pbfree Code
Part Package Code
QFP
Pin Count
256
ECCN Code
3A001.A.2.C
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Screening Level
MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare A54SX72ACQ256 with alternatives
Compare A54SX72A-CQ256B with alternatives