A54SX72ACQ256 vs A54SX72A-CQ256B feature comparison

A54SX72ACQ256 Microchip Technology Inc

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A54SX72A-CQ256B Microsemi FPGA & SoC

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Rohs Code No Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description CERAMIC, QFP-256 QFF,
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 72000 TYPICAL GATES AVAILABLE IT CAN ALSO OPERATE WITH 3.3V AND 5V
Clock Frequency-Max 217 MHz 217 MHz
Combinatorial Delay of a CLB-Max 1.5 ns 1.4 ns
JESD-30 Code S-CQFP-F256 S-CQFP-F256
JESD-609 Code e0
Length 36 mm 36 mm
Number of CLBs 6036 4024
Number of Equivalent Gates 108000 108000
Number of Inputs 213
Number of Logic Cells 6036
Number of Outputs 213
Number of Terminals 256 256
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Organization 6036 CLBS, 108000 GATES 4024 CLBS, 108000 GATES
Package Body Material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package Code QFF QFF
Package Equivalence Code TPAK256,3SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK FLATPACK
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.3 mm 3.3 mm
Supply Voltage-Max 2.75 V 2.75 V
Supply Voltage-Min 2.25 V 2.25 V
Supply Voltage-Nom 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD
Terminal Form FLAT FLAT
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Width 36 mm 36 mm
Base Number Matches 3 3
Pbfree Code Yes
Part Package Code QFP
Pin Count 256
ECCN Code 3A001.A.2.C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Screening Level MIL-STD-883 Class B
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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