A54SX72A-CQ256B
vs
A54SX72A-CQ256C
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROCHIP TECHNOLOGY INC
Package Description
CERAMIC, CQFP-256
CERAMIC, QFP-256
Reach Compliance Code
compliant
compliant
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
8542.39.00.01
Additional Feature
IT CAN ALSO OPERATE WITH 3.3V AND 5V
2.5V, 3.3V, AND 5.0V MIXED VOLTAGE OPERATION, 5.0V INPUT TOLERANCE
Clock Frequency-Max
217 MHz
206 MHz
Combinatorial Delay of a CLB-Max
1.4 ns
1.5 ns
JESD-30 Code
S-CQFP-F256
S-CQFP-F256
Length
36 mm
36 mm
Number of CLBs
4024
6036
Number of Equivalent Gates
108000
72000
Number of Terminals
256
256
Operating Temperature-Max
125 °C
70 °C
Operating Temperature-Min
-55 °C
Organization
4024 CLBS, 108000 GATES
6036 CLBS, 72000 GATES
Package Body Material
CERAMIC, METAL-SEALED COFIRED
CERAMIC, METAL-SEALED COFIRED
Package Code
QFF
QFF
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK
FLATPACK
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Screening Level
MIL-STD-883 Class B
Seated Height-Max
3.3 mm
Supply Voltage-Max
2.75 V
2.7 V
Supply Voltage-Min
2.25 V
2.3 V
Supply Voltage-Nom
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
MILITARY
COMMERCIAL
Terminal Form
FLAT
FLAT
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
36 mm
36 mm
Base Number Matches
3
3
JESD-609 Code
e0
Package Equivalence Code
TPAK256,3SQ,20
Terminal Finish
TIN LEAD
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