A54SX72ACQ256
vs
A54SX72A-FCQ256I
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
ACTEL CORP
|
MICROSEMI CORP
|
| Package Description |
CERAMIC, QFP-256
|
QFF,
|
| Reach Compliance Code |
compliant
|
compliant
|
| Additional Feature |
72000 TYPICAL GATES AVAILABLE
|
72000 TYPICAL GATES AVAILABLE
|
| Clock Frequency-Max |
217 MHz
|
|
| Combinatorial Delay of a CLB-Max |
1.5 ns
|
1.8 ns
|
| JESD-30 Code |
S-CQFP-F256
|
S-CQFP-F256
|
| JESD-609 Code |
e0
|
|
| Length |
36 mm
|
36 mm
|
| Number of CLBs |
6036
|
6036
|
| Number of Equivalent Gates |
108000
|
108000
|
| Number of Inputs |
213
|
|
| Number of Logic Cells |
6036
|
|
| Number of Outputs |
213
|
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
6036 CLBS, 108000 GATES
|
6036 CLBS, 108000 GATES
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
QFF
|
QFF
|
| Package Equivalence Code |
TPAK256,3SQ,20
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
225
|
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.3 mm
|
2.69 mm
|
| Supply Voltage-Max |
2.75 V
|
2.75 V
|
| Supply Voltage-Min |
2.25 V
|
2.25 V
|
| Supply Voltage-Nom |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
FLAT
|
FLAT
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
36 mm
|
36 mm
|
| Base Number Matches |
3
|
3
|
| HTS Code |
|
8542.39.00.01
|
|
|
|
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