Findchips: Compare A3P600-2PQ208Y vs A3P600-1FGG256II

A3P600-2PQ208Y vs A3P600-1FGG256II feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Transferred
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROSEMI CORP
Part Package Code	QFP
Package Description	FQFP,	BGA,
Pin Count	208
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PQFP-G208	S-PBGA-B256
Length	28 mm	17 mm
Number of CLBs	13824	13824
Number of Equivalent Gates	600000	600000
Number of Terminals	208	256
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min		-40 °C
Organization	13824 CLBS, 600000 GATES	13824 CLBS, 600000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	FQFP	BGA
Package Shape	SQUARE	SQUARE
Package Style	FLATPACK, FINE PITCH	GRID ARRAY
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	4.1 mm	1.8 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	GULL WING	BALL
Terminal Pitch	0.5 mm	1 mm
Terminal Position	QUAD	BOTTOM
Width	28 mm	17 mm
Base Number Matches	4	2
Rohs Code		Yes
Clock Frequency-Max		350 MHz
Moisture Sensitivity Level		3
Package Equivalence Code		BGA256,16X16,40
Peak Reflow Temperature (Cel)		250
Qualification Status		Not Qualified
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays