A3P600-1FGG256II
vs
A3P600-1FG256IY
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
MICROSEMI CORP
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
BGA,
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Clock Frequency-Max |
350 MHz
|
|
JESD-30 Code |
S-PBGA-B256
|
|
Length |
17 mm
|
|
Moisture Sensitivity Level |
3
|
|
Number of CLBs |
13824
|
|
Number of Equivalent Gates |
600000
|
|
Number of Terminals |
256
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
13824 CLBS, 600000 GATES
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
BGA
|
|
Package Equivalence Code |
BGA256,16X16,40
|
|
Package Shape |
SQUARE
|
|
Package Style |
GRID ARRAY
|
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.8 mm
|
|
Supply Voltage-Max |
1.575 V
|
|
Supply Voltage-Min |
1.425 V
|
|
Supply Voltage-Nom |
1.5 V
|
|
Surface Mount |
YES
|
|
Technology |
CMOS
|
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
BALL
|
|
Terminal Pitch |
1 mm
|
|
Terminal Position |
BOTTOM
|
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
|
Base Number Matches |
2
|
2
|
|
|
|
Compare A3P600-1FGG256II with alternatives
Compare A3P600-1FG256IY with alternatives