A3P600-1FG256IY
vs
A3P600-1FG256
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
FPBGA-256
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2016-03-25
Category CO2 Kg
12.2
12.2
Compliance Temperature Grade
Industrial: -40C to +100C
Commercial Extended: +0C to +85C
Candidate List Date
2017-07-07
2020-06-25
Conflict Mineral Status
DRC Conflict Free
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V5.10
CMRT V6.10
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Base Number Matches
2
3
Rohs Code
Factory Lead Time
8 Weeks
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B256
Length
17 mm
Moisture Sensitivity Level
3
Number of CLBs
13824
Number of Equivalent Gates
600000
Number of Inputs
177
Number of Outputs
177
Number of Terminals
256
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
13824 CLBS, 600000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Equivalence Code
BGA256,16X16,40
Package Shape
SQUARE
Package Style
GRID ARRAY
Packing Method
TRAY
Qualification Status
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
17 mm
Compare A3P600-1FG256IY with alternatives
Compare A3P600-1FG256 with alternatives