Findchips: Compare A3P250-FG144II vs A3P250-FGG144Y

A3P250-FG144II vs A3P250-FGG144Y feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Active	Transferred
Ihs Manufacturer	MICROCHIP TECHNOLOGY INC	MICROSEMI CORP
Package Description	13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144	LBGA,
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Clock Frequency-Max	350 MHz
JESD-30 Code	S-PBGA-B144	S-PBGA-B144
Length	13 mm	13 mm
Number of CLBs	6144	6144
Number of Equivalent Gates	250000	250000
Number of Inputs	97
Number of Outputs	97
Number of Terminals	144	144
Operating Temperature-Max	85 °C	85 °C
Operating Temperature-Min	-40 °C
Organization	6144 CLBS, 250000 GATES	6144 CLBS, 250000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	LBGA
Package Equivalence Code	BGA144,12X12,40	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Qualification Status	Not Qualified
Seated Height-Max	1.55 mm	1.55 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	INDUSTRIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Width	13 mm	13 mm
Base Number Matches	3	3
Rohs Code		Yes
JESD-609 Code		e1
Moisture Sensitivity Level		3
Peak Reflow Temperature (Cel)		260
Terminal Finish		Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)		30
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays