A3P250-FG144II
vs
A3P250-FG144I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
ACTEL CORP
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, FBGA-144
1 MM PITCH, FBGA-144
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
13 mm
13 mm
Number of CLBs
6144
Number of Equivalent Gates
250000
250000
Number of Inputs
97
Number of Outputs
97
Number of Terminals
144
144
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
6144 CLBS, 250000 GATES
250000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA144,12X12,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.55 mm
1.55 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
13 mm
13 mm
Base Number Matches
3
3
Rohs Code
No
Moisture Sensitivity Level
3
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