Findchips: Compare A3P250-FGG144Y vs A3P250-FGG144YT

A3P250-FGG144Y vs A3P250-FGG144YT feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Transferred	Active
Ihs Manufacturer	MICROSEMI SOC PRODUCTS GROUP	MICROCHIP TECHNOLOGY INC
Part Package Code	BGA
Package Description	LBGA,
Pin Count	144
Reach Compliance Code	unknown	compliant
HTS Code	8542.39.00.01	8542.39.00.01
JESD-30 Code	S-PBGA-B144	S-PBGA-B144
JESD-609 Code	e1	e1
Length	13 mm	13 mm
Moisture Sensitivity Level	3	3
Number of CLBs	6144
Number of Equivalent Gates	250000	250000
Number of Terminals	144	144
Operating Temperature-Max	85 °C	125 °C
Operating Temperature-Min		-40 °C
Organization	6144 CLBS, 250000 GATES	250000 GATES
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LBGA	LBGA
Package Equivalence Code	BGA144,12X12,40	BGA144,12X12,40
Package Shape	SQUARE	SQUARE
Package Style	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)	260	260
Programmable Logic Type	FIELD PROGRAMMABLE GATE ARRAY	FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max	1.55 mm	1.55 mm
Supply Voltage-Max	1.575 V	1.575 V
Supply Voltage-Min	1.425 V	1.425 V
Supply Voltage-Nom	1.5 V	1.5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	COMMERCIAL	AUTOMOTIVE
Terminal Finish	Tin/Silver/Copper (Sn/Ag/Cu)	TIN SILVER COPPER
Terminal Form	BALL	BALL
Terminal Pitch	1 mm	1 mm
Terminal Position	BOTTOM	BOTTOM
Time@Peak Reflow Temperature-Max (s)	30	30
Width	13 mm	13 mm
Base Number Matches	3	3
Rohs Code		Yes
Clock Frequency-Max		350 MHz
Number of Inputs		97
Number of Logic Cells		6144
Number of Outputs		97
Screening Level		AEC-Q100
	Programmable Logic » Field Programmable Gate Arrays	Programmable Logic » Field Programmable Gate Arrays