A3P250-2FGG144
vs
A3P250-2FG144IY
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Package Description
LBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
JESD-609 Code
e1
Length
13 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Terminals
144
Operating Temperature-Max
85 °C
Operating Temperature-Min
Organization
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Base Number Matches
18
2
Compare A3P250-2FGG144 with alternatives
Compare A3P250-2FG144IY with alternatives