A3P250-2FG144IY
vs
A3P250-2FGG144I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Base Number Matches
2
3
Rohs Code
Package Description
LBGA,
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
JESD-609 Code
e1
Length
13 mm
Moisture Sensitivity Level
3
Number of CLBs
6144
Number of Equivalent Gates
250000
Number of Terminals
144
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
6144 CLBS, 250000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Compare A3P250-2FG144IY with alternatives
Compare A3P250-2FGG144I with alternatives