A3P250-2FGG144 vs A3P250-2FG144YI feature comparison

A3P250-2FGG144 Actel Corporation

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A3P250-2FG144YI Microsemi Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ACTEL CORP MICROSEMI CORP
Package Description 1 MM PITCH, GREEN, FBGA-144 LBGA,
Reach Compliance Code unknown compliant
JESD-30 Code S-PBGA-B144 S-PBGA-B144
Length 13 mm 13 mm
Number of Equivalent Gates 250000 250000
Number of Terminals 144 144
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 250000 GATES 6144 CLBS, 250000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 13 mm
Base Number Matches 3 3
HTS Code 8542.39.00.01
JESD-609 Code e0
Moisture Sensitivity Level 3
Number of CLBs 6144
Terminal Finish TIN LEAD SILVER

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