A3P125-1FGG144YT vs A3P125-2TQG144Y feature comparison

A3P125-1FGG144YT Microchip Technology Inc

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A3P125-2TQG144Y Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144 S-PQFP-G144
JESD-609 Code e1
Length 13 mm 20 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 125000 125000
Number of Inputs 97
Number of Logic Cells 3072
Number of Outputs 97
Number of Terminals 144 144
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C
Organization 125000 GATES 3072 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LFQFP
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Seated Height-Max 1.55 mm 1.6 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE COMMERCIAL
Terminal Finish TIN SILVER COPPER
Terminal Form BALL GULL WING
Terminal Pitch 1 mm 0.5 mm
Terminal Position BOTTOM QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 20 mm
Base Number Matches 1 2
Part Package Code QFP
Package Description LFQFP,
Pin Count 144
Number of CLBs 3072

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