A3P125-1FGG144YT vs A3P125-1FG144YI feature comparison

A3P125-1FGG144YT Microchip Technology Inc

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A3P125-1FG144YI Microsemi FPGA & SoC

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 125000 125000
Number of Inputs 97
Number of Logic Cells 3072
Number of Outputs 97
Number of Terminals 144 144
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 125000 GATES 3072 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 13 mm
Base Number Matches 3 3
Part Package Code BGA
Package Description LBGA,
Pin Count 144
Number of CLBs 3072

Compare A3P125-1FGG144YT with alternatives

Compare A3P125-1FG144YI with alternatives