A3P125-1FGG144YT
vs
A3P125-1FG144YC
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
JESD-609 Code
e1
e0
Length
13 mm
Moisture Sensitivity Level
3
3
Number of Equivalent Gates
125000
Number of Inputs
97
Number of Logic Cells
3072
Number of Outputs
97
Number of Terminals
144
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Organization
125000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Screening Level
AEC-Q100
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
13 mm
Base Number Matches
3
3
Package Description
,
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