A3P125-1FGG144YT vs A3P125-1FG144T feature comparison

A3P125-1FGG144YT Microchip Technology Inc

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A3P125-1FG144T Microchip Technology Inc

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Active Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROCHIP TECHNOLOGY INC
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz 350 MHz
JESD-30 Code S-PBGA-B144 S-PBGA-B144
JESD-609 Code e1 e0
Length 13 mm 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 125000 125000
Number of Inputs 97 97
Number of Logic Cells 3072 3072
Number of Outputs 97 97
Number of Terminals 144 144
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Organization 125000 GATES 3072 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA144,12X12,40 BGA144,12X12,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Screening Level AEC-Q100 AEC-Q100
Seated Height-Max 1.55 mm 1.55 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm 13 mm
Base Number Matches 1 1
Package Description 1 MM PITCH, FBGA-144
Factory Lead Time 18 Weeks
Number of CLBs 3072
Packing Method TRAY
Qualification Status Not Qualified

Compare A3P125-1FGG144YT with alternatives

Compare A3P125-1FG144T with alternatives