A3P125-1FG144T vs A3P125-1FGG144YT feature comparison

A3P125-1FG144T Actel Corporation

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A3P125-1FGG144YT Microsemi Corporation

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Rohs Code No Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer ACTEL CORP MICROSEMI CORP
Package Description 1 MM PITCH, FBGA-144
Reach Compliance Code unknown compliant
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144
Length 13 mm
Number of CLBs 3072
Number of Equivalent Gates 125000
Number of Inputs 97
Number of Logic Cells 3072
Number of Outputs 97
Number of Terminals 144
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Organization 3072 CLBS, 125000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Screening Level AEC-Q100
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm
Base Number Matches 3 3
HTS Code 8542.39.00.01
JESD-609 Code e1
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 30

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