A3P1000L-1FG256I
vs
A3P600L-1FG144Y
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI CORP
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
BGA, BGA144,12X12,40
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Category CO2 Kg
12.2
12.2
Compliance Temperature Grade
Industrial: -40C to +85C
Commercial: +0C to +70C
Candidate List Date
2020-06-25
Conflict Mineral Status
DRC Conflict Free Undeterminable
DRC Conflict Free
Conflict Mineral Status Source
CMRT V6.10
CMRT V5.10
Clock Frequency-Max
350 MHz
250 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B144
Length
17 mm
Moisture Sensitivity Level
3
3
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Inputs
177
97
Number of Logic Cells
24576
13824
Number of Outputs
177
97
Number of Terminals
256
144
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA256,16X16,40
BGA144,12X12,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
Base Number Matches
3
3
JESD-609 Code
e0
Terminal Finish
TIN LEAD
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