A3P1000L-1FG256I vs A3P1000L-1FGG256Y feature comparison

A3P1000L-1FG256I Microchip Technology Inc

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A3P1000L-1FGG256Y Microsemi FPGA & SoC

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Rohs Code No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI SOC PRODUCTS GROUP
Package Description 17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256 BGA, BGA256,16X16,40
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Clock Frequency-Max 350 MHz 250 MHz
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm
Moisture Sensitivity Level 3 3
Number of CLBs 24576
Number of Equivalent Gates 1000000
Number of Inputs 177 177
Number of Logic Cells 24576 24576
Number of Outputs 177 177
Number of Terminals 256 256
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY GRID ARRAY
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.14 V
Supply Voltage-Nom 1.2 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 17 mm
Base Number Matches 3 3
JESD-609 Code e1
Peak Reflow Temperature (Cel) 250
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s) 30

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