A3P1000L-1FG256I
vs
A3P1000L-PQ208YI
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
MICROCHIP TECHNOLOGY INC
MICROSEMI SOC PRODUCTS GROUP
Package Description
17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256
QFP, QFP208,1.2SQ,20
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
8 Weeks
Clock Frequency-Max
350 MHz
250 MHz
JESD-30 Code
S-PBGA-B256
S-PQFP-G208
Length
17 mm
Moisture Sensitivity Level
3
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Inputs
177
154
Number of Logic Cells
24576
24576
Number of Outputs
177
154
Number of Terminals
256
208
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
QFP
Package Equivalence Code
BGA256,16X16,40
QFP208,1.2SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
FLATPACK
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.8 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.14 V
Supply Voltage-Nom
1.2 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Width
17 mm
Base Number Matches
3
3
Compare A3P1000L-1FG256I with alternatives
Compare A3P1000L-PQ208YI with alternatives