A3P1000-FG256YT vs A3P1000-FG256 feature comparison

A3P1000-FG256YT Microsemi FPGA & SoC

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A3P1000-FG256 Microsemi Corporation

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI SOC PRODUCTS GROUP MICROSEMI CORP
Package Description , BGA,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-609 Code e0
Moisture Sensitivity Level 3 3
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish TIN LEAD SILVER
Base Number Matches 1 27
Rohs Code No
Samacsys Manufacturer Microsemi Corporation
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B256
Length 17 mm
Number of CLBs 24576
Number of Equivalent Gates 1000000
Number of Terminals 256
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 24576 CLBS, 1000000 GATES
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Equivalence Code BGA256,16X16,40
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 1.8 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 17 mm

Compare A3P1000-FG256YT with alternatives

Compare A3P1000-FG256 with alternatives