A3P1000-1FGG144YC vs A3P1000-1FG144YM feature comparison

A3P1000-1FGG144YC Microsemi Corporation

Buy Now Datasheet

A3P1000-1FG144YM Microsemi Corporation

Buy Now Datasheet
Rohs Code Yes No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-609 Code e1 e0
Moisture Sensitivity Level 3 3
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu) TIN LEAD SILVER
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 3 3
Package Description FPBGA-144
ECCN Code 3A001.A.2.C
Clock Frequency-Max 250 MHz
JESD-30 Code S-PBGA-B144
Length 13 mm
Number of Equivalent Gates 1000000
Number of Inputs 154
Number of Logic Cells 24576
Number of Outputs 154
Number of Terminals 144
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 1000000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade MILITARY
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Width 13 mm

Compare A3P1000-1FGG144YC with alternatives

Compare A3P1000-1FG144YM with alternatives