A3P1000-1FGG144YC
vs
A3P1000-1FGG144I
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
MICROSEMI CORP
MICROCHIP TECHNOLOGY INC
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-609 Code
e1
e1
Moisture Sensitivity Level
3
3
Peak Reflow Temperature (Cel)
260
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN SILVER COPPER
Time@Peak Reflow Temperature-Max (s)
30
30
Base Number Matches
3
3
Package Description
13X 13 MM, 1.45 MM HEIGHT, 1 MM PITCH, GREEN, FBGA-144
Clock Frequency-Max
350 MHz
JESD-30 Code
S-PBGA-B144
Length
13 mm
Number of CLBs
24576
Number of Equivalent Gates
1000000
Number of Inputs
97
Number of Outputs
97
Number of Terminals
144
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
Organization
24576 CLBS, 1000000 GATES
Package Body Material
PLASTIC/EPOXY
Package Code
LBGA
Package Equivalence Code
BGA144,12X12,40
Package Shape
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
Packing Method
TRAY
Qualification Status
Not Qualified
Seated Height-Max
1.55 mm
Supply Voltage-Max
1.575 V
Supply Voltage-Min
1.425 V
Supply Voltage-Nom
1.5 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
1 mm
Terminal Position
BOTTOM
Width
13 mm
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