A3P1000-1FG144YM
vs
A3P1000-1FGG144M
feature comparison
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
| Part Package Code |
BGA
|
|
| Package Description |
LBGA,
|
LBGA, BGA144,12X12,40
|
| Pin Count |
144
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| JESD-30 Code |
S-PBGA-B144
|
S-PBGA-B144
|
| Length |
13 mm
|
13 mm
|
| Number of CLBs |
24576
|
24576
|
| Number of Equivalent Gates |
1000000
|
1000000
|
| Number of Terminals |
144
|
144
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-55 °C
|
| Organization |
24576 CLBS, 1000000 GATES
|
24576 CLBS, 1000000 GATES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LBGA
|
LBGA
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
| Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
| Seated Height-Max |
1.55 mm
|
1.55 mm
|
| Supply Voltage-Max |
1.575 V
|
1.575 V
|
| Supply Voltage-Min |
1.14 V
|
1.425 V
|
| Supply Voltage-Nom |
1.2 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
MILITARY
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
13 mm
|
13 mm
|
| Base Number Matches |
3
|
3
|
| Rohs Code |
|
Yes
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Clock Frequency-Max |
|
350 MHz
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
3
|
| Number of Inputs |
|
97
|
| Number of Logic Cells |
|
24576
|
| Number of Outputs |
|
97
|
| Package Equivalence Code |
|
BGA144,12X12,40
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Terminal Finish |
|
TIN SILVER COPPER
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
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