A3P1000-1FGG144YC vs A3P1000-1FG256YT feature comparison

A3P1000-1FGG144YC Microchip Technology Inc

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A3P1000-1FG256YT Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Active Transferred
Ihs Manufacturer MICROCHIP TECHNOLOGY INC MICROSEMI CORP
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Clock Frequency-Max 350 MHz
JESD-30 Code S-PBGA-B144
JESD-609 Code e1 e0
Length 13 mm
Moisture Sensitivity Level 3 3
Number of Equivalent Gates 1000000
Number of Inputs 97
Number of Logic Cells 24576
Number of Outputs 97
Number of Terminals 144
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 1000000 GATES
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA144,12X12,40
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.55 mm
Supply Voltage-Max 1.575 V
Supply Voltage-Min 1.425 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN SILVER COPPER TIN LEAD SILVER
Terminal Form BALL
Terminal Pitch 1 mm
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 13 mm
Base Number Matches 1 1
Package Description ,

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