A3P060-QNG132I
vs
A3P060-2CS121Y
feature comparison
All Stats
Differences Only
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICROSEMI CORP
MICROSEMI CORP
Package Description
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132
VFBGA,
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
S-XBCC-B132
S-PBGA-B121
Length
8 mm
6 mm
Moisture Sensitivity Level
2
Number of CLBs
1536
1536
Number of Equivalent Gates
60000
60000
Number of Inputs
80
Number of Outputs
80
Number of Terminals
132
121
Operating Temperature-Max
100 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1536 CLBS, 60000 GATES
1536 CLBS, 60000 GATES
Package Body Material
UNSPECIFIED
PLASTIC/EPOXY
Package Code
HVBCC
VFBGA
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FIELD PROGRAMMABLE GATE ARRAY
Qualification Status
Not Qualified
Seated Height-Max
0.8 mm
0.99 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Form
BUTT
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
6 mm
Base Number Matches
2
3
Package Equivalence Code
BGA121,11X11,20
Compare A3P060-QNG132I with alternatives
Compare A3P060-2CS121Y with alternatives