A3P060-QNG132I vs A3P060-2CS121Y feature comparison

A3P060-QNG132I Microsemi Corporation

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A3P060-2CS121Y Microsemi Corporation

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Rohs Code Yes No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Package Description 8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, GREEN, QFN-132 VFBGA,
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-XBCC-B132 S-PBGA-B121
Length 8 mm 6 mm
Moisture Sensitivity Level 2
Number of CLBs 1536 1536
Number of Equivalent Gates 60000 60000
Number of Inputs 80
Number of Outputs 80
Number of Terminals 132 121
Operating Temperature-Max 100 °C 85 °C
Operating Temperature-Min -40 °C
Organization 1536 CLBS, 60000 GATES 1536 CLBS, 60000 GATES
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVBCC VFBGA
Package Shape SQUARE SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY FIELD PROGRAMMABLE GATE ARRAY
Qualification Status Not Qualified
Seated Height-Max 0.8 mm 0.99 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form BUTT BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm 6 mm
Base Number Matches 2 3
Package Equivalence Code BGA121,11X11,20

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