A3P060-QN132YI
vs
A3P060-QN132
feature comparison
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICROSEMI SOC PRODUCTS GROUP
|
MICROSEMI CORP
|
Part Package Code |
QFP
|
|
Package Description |
QCCN,
|
8 X 8 MM, 0.75 MM HEIGHT, 0.50 MM PITCH, QFN-132
|
Pin Count |
132
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-XQCC-N132
|
S-XBCC-B132
|
Length |
8 mm
|
8 mm
|
Number of CLBs |
1536
|
1536
|
Number of Equivalent Gates |
60000
|
60000
|
Number of Terminals |
132
|
132
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
1536 CLBS, 60000 GATES
|
1536 CLBS, 60000 GATES
|
Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
Package Code |
QCCN
|
HVBCC
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY
|
FIELD PROGRAMMABLE GATE ARRAY
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
NO LEAD
|
BUTT
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
8 mm
|
8 mm
|
Base Number Matches |
1
|
6
|
Rohs Code |
|
No
|
Clock Frequency-Max |
|
350 MHz
|
Peak Reflow Temperature (Cel) |
|
235
|
Qualification Status |
|
Not Qualified
|
Seated Height-Max |
|
0.8 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare A3P060-QN132YI with alternatives
Compare A3P060-QN132 with alternatives