A2F500M3G-FGG256M
vs
A2F500M3F-FGH256I
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROSEMI CORP
|
Package Description |
FPBGA-256
|
1 MM PITCH, HALOGEN FREE, FBGA-256
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A001.A.2.C
|
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
S-PBGA-B256
|
S-PBGA-B256
|
Length |
17 mm
|
17 mm
|
Moisture Sensitivity Level |
3
|
|
Number of Equivalent Gates |
500000
|
500000
|
Number of Inputs |
117
|
117
|
Number of Logic Cells |
11520
|
11520
|
Number of Outputs |
117
|
117
|
Number of Terminals |
256
|
256
|
Operating Temperature-Max |
125 °C
|
100 °C
|
Operating Temperature-Min |
-55 °C
|
-40 °C
|
Organization |
500000 GATES
|
500000 GATES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LBGA
|
LBGA
|
Package Equivalence Code |
BGA256,16X16,40
|
BGA256,16X16,40
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
GRID ARRAY, LOW PROFILE
|
GRID ARRAY, LOW PROFILE
|
Peak Reflow Temperature (Cel) |
250
|
|
Programmable Logic Type |
FPGA SOC
|
FPGA SOC
|
Seated Height-Max |
1.7 mm
|
1.7 mm
|
Supply Voltage-Max |
1.575 V
|
1.575 V
|
Supply Voltage-Min |
1.425 V
|
1.425 V
|
Supply Voltage-Nom |
1.5 V
|
1.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
17 mm
|
17 mm
|
Base Number Matches |
1
|
2
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare A2F500M3G-FGG256M with alternatives
Compare A2F500M3F-FGH256I with alternatives