A2F500M3G-FGG256M
vs
A2F500M3G-FGG256Y
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICROSEMI CORP
ACTEL CORP
Package Description
FPBGA-256
1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code
compliant
unknown
ECCN Code
3A001.A.2.C
HTS Code
8542.39.00.01
Samacsys Manufacturer
Microsemi Corporation
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Moisture Sensitivity Level
3
Number of Equivalent Gates
500000
500000
Number of Inputs
117
66
Number of Logic Cells
11520
11520
Number of Outputs
117
66
Number of Terminals
256
256
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
Organization
500000 GATES
11520 CLBS, 500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel)
250
Programmable Logic Type
FPGA SOC
FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
17 mm
17 mm
Base Number Matches
2
3
Clock Frequency-Max
80 MHz
Number of CLBs
11520
Qualification Status
Not Qualified
Temperature Grade
OTHER