A2F500M3G-FGG256M vs A2F500M3G-FGG256Y feature comparison

A2F500M3G-FGG256M Microsemi Corporation

Buy Now Datasheet

A2F500M3G-FGG256Y Actel Corporation

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICROSEMI CORP ACTEL CORP
Package Description FPBGA-256 1 MM PITCH, GREEN, FBGA-256
Reach Compliance Code compliant unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.39.00.01
Samacsys Manufacturer Microsemi Corporation
JESD-30 Code S-PBGA-B256 S-PBGA-B256
Length 17 mm 17 mm
Moisture Sensitivity Level 3
Number of Equivalent Gates 500000 500000
Number of Inputs 117 66
Number of Logic Cells 11520 11520
Number of Outputs 117 66
Number of Terminals 256 256
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C
Organization 500000 GATES 11520 CLBS, 500000 GATES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LBGA LBGA
Package Equivalence Code BGA256,16X16,40 BGA256,16X16,40
Package Shape SQUARE SQUARE
Package Style GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
Peak Reflow Temperature (Cel) 250
Programmable Logic Type FPGA SOC FIELD PROGRAMMABLE GATE ARRAY
Seated Height-Max 1.7 mm 1.7 mm
Supply Voltage-Max 1.575 V 1.575 V
Supply Voltage-Min 1.425 V 1.425 V
Supply Voltage-Nom 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 17 mm 17 mm
Base Number Matches 2 3
Clock Frequency-Max 80 MHz
Number of CLBs 11520
Qualification Status Not Qualified
Temperature Grade OTHER