A2F500M3F-FGH256I
vs
A2F500M3F-FG256YI
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
ACTEL CORP
MICROSEMI CORP
Package Description
1 MM PITCH, HALOGEN FREE, FBGA-256
LBGA,
Reach Compliance Code
unknown
compliant
Clock Frequency-Max
80 MHz
JESD-30 Code
S-PBGA-B256
S-PBGA-B256
Length
17 mm
17 mm
Number of CLBs
11520
Number of Equivalent Gates
500000
500000
Number of Inputs
66
117
Number of Logic Cells
11520
11520
Number of Outputs
66
117
Number of Terminals
256
256
Organization
11520 CLBS, 500000 GATES
500000 GATES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LBGA
LBGA
Package Equivalence Code
BGA256,16X16,40
BGA256,16X16,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE
GRID ARRAY, LOW PROFILE
Programmable Logic Type
FIELD PROGRAMMABLE GATE ARRAY
FPGA SOC
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.7 mm
1.7 mm
Supply Voltage-Max
1.575 V
1.575 V
Supply Voltage-Min
1.425 V
1.425 V
Supply Voltage-Nom
1.5 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
17 mm
17 mm
Base Number Matches
2
3
HTS Code
8542.39.00.01
Moisture Sensitivity Level
3
Operating Temperature-Max
100 °C
Operating Temperature-Min
-40 °C
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