9FGL639AKLF vs MB88155PFTG-112-BNDE1 feature comparison

9FGL639AKLF Integrated Device Technology Inc

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MB88155PFTG-112-BNDE1 FUJITSU Limited

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer INTEGRATED DEVICE TECHNOLOGY INC FUJITSU LTD
Package Description HVQCCN, TSSOP, TSSOP8,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code S-XQCC-N32 R-PDSO-G8
Length 5 mm 4.4 mm
Number of Terminals 32 8
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Output Clock Frequency-Max 25 MHz 25 MHz
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code HVQCCN TSSOP
Package Shape SQUARE RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Primary Clock/Crystal Frequency-Nom 25 MHz 25 MHz
Seated Height-Max 1 mm 1.1 mm
Supply Voltage-Max 3.465 V 3.6 V
Supply Voltage-Min 3.135 V 3 V
Supply Voltage-Nom 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Form NO LEAD GULL WING
Terminal Pitch 0.5 mm 0.65 mm
Terminal Position QUAD DUAL
Width 5 mm 3 mm
uPs/uCs/Peripheral ICs Type CLOCK GENERATOR, OTHER CLOCK GENERATOR, OTHER
Base Number Matches 2 1
Package Equivalence Code TSSOP8,.25
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Supply Current-Max 7 mA
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 9FGL639AKLF with alternatives

Compare MB88155PFTG-112-BNDE1 with alternatives