935262750125 vs 74HC1G02GW,165 feature comparison

935262750125 Nexperia

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74HC1G02GW,165 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description TSSOP, TSSOP, TSSOP5/6,.08
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family AHC/VHC/H/U/V HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Logic IC Type NOR GATE NOR GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR, 7 INCH TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 14.5 ns 135 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Tin (Sn)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Part Package Code TSSOP
Pin Count 5
Manufacturer Package Code SOT353-1
Load Capacitance (CL) 50 pF
Max I(ol) 0.002 A
Package Equivalence Code TSSOP5/6,.08
Prop. Delay@Nom-Sup 27 ns
Schmitt Trigger NO

Compare 935262750125 with alternatives

Compare 74HC1G02GW,165 with alternatives