74HC1G02GW,165
vs
HD74HC1G02-EL
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
HITACHI LTD
|
| Part Package Code |
TSSOP
|
SOIC
|
| Package Description |
TSSOP, TSSOP5/6,.08
|
TSSOP,
|
| Pin Count |
5
|
5
|
| Manufacturer Package Code |
SOT353-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
| JESD-609 Code |
e3
|
|
| Length |
2.05 mm
|
2 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
NOR GATE
|
NOR GATE
|
| Max I(ol) |
0.002 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
2
|
2
|
| Number of Terminals |
5
|
5
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP5/6,.08
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
TR
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Prop. Delay@Nom-Sup |
27 ns
|
|
| Propagation Delay (tpd) |
135 ns
|
125 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Schmitt Trigger |
NO
|
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
Tin (Sn)
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
1.25 mm
|
1.25 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
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Compare HD74HC1G02-EL with alternatives