74HC1G02GW,165 vs 74HC1G02GW,125 feature comparison

74HC1G02GW,165 NXP Semiconductors

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74HC1G02GW,125 Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP TSSOP
Package Description TSSOP, TSSOP5/6,.08 TSSOP-5
Pin Count 5 5
Manufacturer Package Code SOT353-1 SOT353-1
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2.05 mm 2.05 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.002 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR TR, 7 INCH
Peak Reflow Temperature (Cel) NOT SPECIFIED 260
Prop. Delay@Nom-Sup 27 ns
Propagation Delay (tpd) 135 ns 135 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Tin (Sn) TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED 30
Width 1.25 mm 1.25 mm
Base Number Matches 2 2
Factory Lead Time 6 Weeks
Date Of Intro 1998-08-31
Samacsys Manufacturer Nexperia

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