935024270112
vs
54F776/BYA
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS COMPONENTS
|
| Part Package Code |
DIP
|
|
| Package Description |
0.300 INCH, PLASTIC, DIP-20
|
,
|
| Pin Count |
20
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
F/FAST
|
F/FAST
|
| JESD-30 Code |
R-PDIP-T20
|
R-CDFP-F28
|
| Length |
26.73 mm
|
|
| Logic IC Type |
REGISTERED BUS TRANSCEIVER
|
REGISTERED BUS TRANSCEIVER
|
| Number of Bits |
1
|
8
|
| Number of Functions |
3
|
1
|
| Number of Ports |
2
|
2
|
| Number of Terminals |
20
|
28
|
| Operating Temperature-Max |
70 °C
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Output Characteristics |
OPEN-COLLECTOR/3-STATE
|
OPEN-COLLECTOR/3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
DFP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLATPACK
|
| Peak Reflow Temperature (Cel) |
245
|
|
| Propagation Delay (tpd) |
11.5 ns
|
11.5 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
FLAT
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
7.62 mm
|
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
WITH DESIGNATED TTL AND BTL PORTS; COMPATIBLE WITH PI-BUS & IEEE 896 FUTUREBUS STANDARDS
|
| Load Capacitance (CL) |
|
50 pF
|
| Package Equivalence Code |
|
FL28(UNSPEC)
|
| Power Supply Current-Max (ICC) |
|
145 mA
|
|
|
|
Compare 935024270112 with alternatives
Compare 54F776/BYA with alternatives