935024270112 vs 54F776/B3A feature comparison

935024270112 NXP Semiconductors

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54F776/B3A YAGEO Corporation

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS COMPONENTS
Part Package Code DIP
Package Description 0.300 INCH, PLASTIC, DIP-20
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family F/FAST F/FAST
JESD-30 Code R-PDIP-T20 S-CQCC-N28
Length 26.73 mm
Logic IC Type REGISTERED BUS TRANSCEIVER REGISTERED BUS TRANSCEIVER
Number of Bits 1 8
Number of Functions 3 1
Number of Ports 2 2
Number of Terminals 20 28
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Output Characteristics OPEN-COLLECTOR/3-STATE OPEN-COLLECTOR/3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP QCCN
Package Shape RECTANGULAR SQUARE
Package Style IN-LINE CHIP CARRIER
Peak Reflow Temperature (Cel) 245
Propagation Delay (tpd) 11.5 ns 11.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL TTL
Temperature Grade COMMERCIAL MILITARY
Terminal Form THROUGH-HOLE NO LEAD
Terminal Pitch 2.54 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 40
Width 7.62 mm
Base Number Matches 1 3
Additional Feature WITH DESIGNATED TTL AND BTL PORTS; COMPATIBLE WITH PI-BUS & IEEE 896 FUTUREBUS STANDARDS
Load Capacitance (CL) 50 pF
Power Supply Current-Max (ICC) 145 mA

Compare 935024270112 with alternatives

Compare 54F776/B3A with alternatives