933505310215
vs
1SV101
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
TOSHIBA CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8541.10.00.80
|
|
| Breakdown Voltage-Min |
30 V
|
15 V
|
| Configuration |
SINGLE
|
SINGLE
|
| Diode Capacitance Ratio-Min |
5
|
2
|
| Diode Capacitance-Nom |
31 pF
|
30 pF
|
| Diode Element Material |
SILICON
|
SILICON
|
| Diode Type |
VARIABLE CAPACITANCE DIODE
|
VARIABLE CAPACITANCE DIODE
|
| Frequency Band |
VERY HIGH FREQUENCY
|
|
| JESD-30 Code |
R-PDSO-G3
|
R-PSIP-T2
|
| JESD-609 Code |
e3
|
e0
|
| Moisture Sensitivity Level |
1
|
|
| Number of Elements |
1
|
1
|
| Number of Terminals |
3
|
2
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
YES
|
NO
|
| Terminal Finish |
TIN
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Position |
DUAL
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Variable Capacitance Diode Classification |
ABRUPT
|
ABRUPT
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
SOD
|
| Package Description |
|
R-PSIP-T2
|
| Pin Count |
|
2
|
| Additional Feature |
|
CAPACITANCE MATCHED TO 3%
|
| Rep Pk Reverse Voltage-Max |
|
15 V
|
| Reverse Current-Max |
|
1e-8 µA
|
| Reverse Test Voltage |
|
15 V
|
|
|
|
Compare 933505310215 with alternatives
Compare 1SV101 with alternatives